Semiconductor package with protected sidewall and method of forming the same

ABSTRACT

A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.

BACKGROUND Technical Field

The present disclosure is directed to packages having a semiconductordie sidewall protected by molding compound, and methods of forming thesame.

Description of the Related Art

Wafer Level Chip Scale Packages (“WLCSPs”) that include a silicon die orchip and molding compound are common in the packaging space because oftheir small size and efficient assembly process. One of the biggestchallenges for WLCSPs is chipping or cracking of the silicon die duringhandling, transportation, or during various assembly processes, such asthe surface mount technology assembly process. Past attempts tocounterbalance these negative effects include forming molding compoundin the WLCSPs using a front side mold approach or a fan out approach.However, both of these methods suffer from deficiencies in manufacturingefficiency and limited die protection in the resulting packages, whichleads to an increase in chipping or cracking of the die, or otherpackage failures.

In the front side mold approach, a half cut is performed betweensuccessive die on a wafer and molding compound is formed on the activeside of the wafer and over each die. Because the molding compound isformed on the active side of the wafer, which includes solder bumps, thesolder bumps must be cleaned of any mold residue in order to allow thepackages to function when coupled to a substrate. After the cleaning,the wafer undergoes further processing, which includes separating thedie into individual packages. These individual packages are thenarranged on a carrier for transport.

The resulting WLCSPs produced by the front side mold process do not havesufficient protection on the sidewalls due to constraints of the halfcut kerf width and silicon saw scribe lane width and thus do not provideadequate protection against die cracking or chipping during transport orhandling. Accordingly, WLCSPs produced by the fan out approach remain ata high risk of package failure due to damage to the silicon chip.Further, the front side mold approach is inefficient because it requiresan additional step of cleaning the mold residue on the solder bumpsafter forming the molding compound.

The fan out approach includes singulating a wafer into die, andarranging the usable die on a carrier. Then, molding compound is formedover each of the die on the carrier, with the molding compound formedfrom the backside of each die. This process is known in the art as“reconstruction,” or in other words, constructing a “molded wafer.”After forming the molding compound, the die undergo further processing,including forming multiple redistribution layers covering the activesurface of each die and singulation of the die into packages. Thepackages are then placed on a carrier for transport.

While the fan out approach eliminates the need to clean the mold residuefrom the bumps, the fan out approach causes the molded wafer to be moresusceptible to wafer cracking and breakage during performance of theprocess. As such, multiple warpage adjustment steps have to be performedduring the process. In addition, the re-passivation material is limitedto low cure polymer in order to be compatible with characteristics ofthe molded, reconstructed wafer.

BRIEF SUMMARY

The exemplary embodiments in the present disclosure are directed toimproving reliability of semiconductor packages by reducing thepossibility of chipping or cracking of a die during transport byproviding molding compound on sidewalls and edges of a die. Theexemplary embodiments also eliminate the need for warpage adjustmentduring the redistribution process and enable use of standard WLCSPredistribution materials and processes.

In one exemplary embodiment, a semiconductor package includes a diehaving a first surface opposite a second surface with the first surfacehaving an area defined by a first outermost edge of the first surface. Aredistribution layer, which may be a re-passivation layer or a metal,such as copper, is formed on the first surface of the die. An area ofthe redistribution layer is bounded by a second outermost edge, with thesecond area being less than the first area, so as to create a spacebetween the first and second outermost edges. In other words, becausethe first outermost edge is spaced from the second outermost edge, aportion of the first surface of the die is exposed.

Then, molding compound is formed on the die and the distribution layer,with the molding compound being on the first surface of the die in thespace between the first and second outermost edges described above. Insome examples, the molding compound is also on the sidewalls of the die,as well as on the second surface of the die. In yet other embodiments,the semiconductor package includes one or more under bump metallizationlayers formed on the redistribution layer and solder balls coupled torespective ones of the under bump metallization layers.

In a second exemplary embodiment, a method of forming a semiconductorpackage having the above features is disclosed. The method begins withforming a redistribution layer on a first surface of a silicon waferthat includes a plurality of die. Then, the second surface of thesilicon wafer, which is opposite the first surface, undergoes abackgrinding process to thin down the thickness of the siliconsubstrate. After backgrinding, the wafer is separated into a pluralityof die by mechanical blade, laser processing, or etching. Each of thedie include the first surface and the second surface and a sidewallextending between the first and second surfaces of the die. A portion ofthe redistribution layer is on the first surface of each die. Because anarea of the redistribution layer on each die is less than an area of thefirst surface of each die, a portion of the first surface of die isexposed by the redistribution layer.

After separating the wafer into die, each of the die are inverted andcoupled to a carrier. Then, molding compound is formed on the secondsurface of each die, the sidewalls of the die, and on the portion of thefirst surface of each die that is exposed by the redistribution layer.In other words, because the redistribution layer does not cover thefirst surface of the die, but rather, there is a space between an outeredge of the redistribution layer and an outer edge of the first surfaceof each die, molding compound is on the first surface of each die in thespace.

In a third exemplary embodiment, the method includes coupling aplurality of solder balls to a corresponding one of a plurality of underbump metallization layers and forming a plurality of packages byseparating the die from each other. In a fourth exemplary embodiment, abackgrind is performed on the molding compound before coupling thesolder balls to the under bump metallization layers. In yet a fifthexemplary embodiment, the solder balls are coupled to the under bumpmetallization layers and then a backgrind is performed on the moldingcompound before singulating the die into packages.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a better understanding of the embodiments, reference will now bemade by way of example only to the accompanying drawings. In thedrawings, identical reference numbers identify similar elements or acts.The sizes and relative positions of elements in the drawings are notnecessarily drawn to scale. For example, the shapes of various elementsand angles are not necessarily drawn to scale, and some of theseelements may be enlarged and positioned to improve drawing legibility.

FIG. 1A is a plan view of one side of an exemplary embodiment of asemiconductor package according to the present disclosure having moldingcompound on sidewalls of a die with a surface of the die exposed;

FIG. 1B is a plan view of another side of the semiconductor package ofFIG. 1A illustrating a plurality of solder balls coupled to a pluralityof under bump metallization layers on a redistribution layer;

FIG. 2 is a cross-sectional view of the semiconductor package of FIGS.1A and 1B, through the line 2-2 in FIG. 1B, having molding compound onthe sidewalls and a surface of the die;

FIGS. 3-10 are cross-sectional views of an exemplary embodiment of amethod for processing a plurality of semiconductor die according to thepresent disclosure illustrating the plurality of semiconductor die invarious stages of manufacturing;

FIGS. 11A-B are cross-sectional views of an exemplary embodiment forforming a first plurality of semiconductor packages from the pluralityof semiconductor die of FIGS. 3-10 ;

FIGS. 12A-C are cross-sectional views of an alternative exemplaryembodiment for forming a second plurality of semiconductor packages fromthe plurality of semiconductor die of FIGS. 3-10 ; and

FIGS. 13A-C are cross-sectional views of an alternative exemplaryembodiment for forming a third plurality of semiconductor packages fromthe plurality of semiconductor die of FIGS. 3-10 .

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various disclosedembodiments. However, one skilled in the relevant art will recognizethat embodiments may be practiced without one or more of these specificdetails, or with other methods, components, materials, etc. In otherinstances, well-known structures associated with leadframes and chippackaging have not been shown or described in detail to avoidunnecessarily obscuring descriptions of the embodiments.

Unless the context requires otherwise, throughout the specification andclaims which follow, the word “comprise” and variations thereof, suchas, “comprises” and “comprising” are to be construed in an open,inclusive sense, that is as “including, but not limited to.” Further,the terms “first,” “second,” and similar indicators of sequence are tobe construed as interchangeable unless the context clearly dictatesotherwise.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singularforms “a,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. It should also be noted that the term “or”is generally employed in its broadest sense that is as meaning “and/or”unless the content clearly dictates otherwise.

The present disclosure is generally directed to semiconductor packageshaving a die sidewall protected by molding compound and methods offorming the same. In an embodiment, the molding compound is on thesidewalls of each die and on a first surface of a die between an outeredge of a redistribution layer on the first surface and an outer edge ofthe die. A second surface of the die may be exposed or covered by themolding compound.

FIGS. 1A-B and 2 illustrate a semiconductor package 100 with a die 102having a first surface 103 opposite a second surface 104. In anembodiment, the first surface 103 is an active surface of the die 102and the second surface 104 is a non-active surface, or backside of thedie 102.

As shown in FIG. 1A, the second surface 104 of the die 102 has an areabounded by a first outermost edge 118 extending around the secondsurface 104 of the die 102. The first outermost edge 118 of the secondsurface 104 of the die 102 includes first, second, third and fourthedges 101, 111 105, 107, respectively, of the die 102. One of skill inthe art will appreciate that the first surface 103 can include identicalfeatures to the second surface 104, namely, an area bounded by the firstoutermost edge 118, wherein the first outermost edge 118 comprises fouredges, i.e., forms sidewalls of the semiconductor die. Molding compound106 surrounds the die 102 to protect the die 102, such as duringtransportation. As such, the molding compound is formed adjacent to, orin contact with, the outermost edge 118, which includes each of thefirst, second, third and fourth edges 101, 111, 105, 107.

In the illustrated embodiment, the second surface 104 of the die 102 isexposed, or is not covered by the molding compound 106. However, inother embodiments described below, the molding compound 106 is on thesecond surface 104 of the die 102. Further, in embodiments where thefirst and second surfaces 103, 104 are identical, or are substantiallyequivalent, the first surface 103 has an equivalent, or substantiallyequivalent area to the second surface 104 that is bounded by the firstoutermost edge 118.

In certain other embodiments, the area of the first surface 103 is moreor less than the area of the second surface 104 of the die 102. Further,although the die 102 is illustrated with a generally rectangular shape,one of skill in the art will appreciate that the die 102 can be formedto have a variety of different geometric shapes. In addition, the die102 is preferably a semiconductor comprised of silicon, although othermaterials may be used for the die 102, for example, compound materialsincluding any combination of silicon, germanium, tin, carbon, tellurium,boron, nitrogen, phosphate, arsenic, or other materials. Any number ofmaterials may be used for the molding compound 106, such as a compositematerial consisting of epoxy resins, phenolic hardeners, silicas,catalysts, pigments, or mold release agents, among others.

FIG. 1B is a plan view of the semiconductor package 100 of FIG. 1A witha redistribution layer 110 having a plurality of under bumpmetallization layers 112 formed thereon. As described below withreference to FIG. 2 , the redistribution layer 110 is formed on thefirst surface 103 of the die 102. The redistribution layer 110 and theplurality of under bump metallization layers 112 are preferably formedof copper, or a copper alloy, although other metals and their alloys maybe used. The redistribution layer 110 couples contacts on the die (notshown) with the outside world, i.e., a plurality of solder balls 114coupled to the plurality of under bump metallization layers 112. Inother words, each of the plurality of solder balls 114 is coupled to acorresponding one of the under bump metallization layers 112 formed on,and in electrical communication with, the redistribution layer 110. FIG.1B further illustrates a dashed line 113, which corresponds to the firstoutermost edge 118 (FIG. 1A) of the first surface 103 (FIG. 2 ) of thedie 102 (FIG. 1A). As such, one of skill in the art will appreciate thatalthough the first surface 103 is not shown in FIG. 1B because of themolding compound 106 and the redistribution layer 110, an area of thefirst surface 103 is greater than an area of the redistribution layer110.

The plurality of solder balls 114 are conductive and may be formed fromany number of materials. In addition, although the solder balls 114 areillustrated with a generally circular shape for convenience, one ofskill in the art will appreciate that the solder balls 114 may take theshape of an oval or a pillar, among other options. Similarly, the underbump metallization layers are illustrated as being generally square witha rectangular vertical cross-section, although one of skill in the artwill appreciate that the under bump metallization layers 112 may includea cavity or depression for receiving each of the generally circularsolder balls 114.

The semiconductor package 100 illustrated in FIG. 1B includes theplurality of solder balls 114 including 49 solder balls, each coupled toa respective under bump metallization layer 112, arranged equidistantapart from each other and also equidistant from a second outermost edge120 of the redistribution layer 110. However, one of skill in the artwill appreciate that the plurality of solder balls 114 and under bumpmetallization layers 112 may include more or less than the numberillustrated, for example, embodiments of the present disclosure includethe plurality of solder balls comprising any number of solder balls from1 to 100, or more, solder balls. Similarly, it may be preferable,depending on the application for the package 100, for the spacingbetween each solder ball 114 and each under bump metallization layer 112to be different from each other, as well as spaced a larger or smallerdistance from the second outermost edge 120 than the distance shown inFIG. 1B. As such, the present disclosure is not limited by the numberand arrangement of the plurality of solder balls 114 and under bumpmetallization layers 112.

The redistribution layer 110 has an area bounded by the second outermostedge 120 extending around the redistribution layer 110. In thisembodiment, the area of the redistribution layer 110 is less than thearea of the first and second surfaces 103, 104 of the die 102. As willbe explained in more detail below, this difference in area exposes aportion of the first surface 103 of the die.

FIG. 2 is a cross-sectional view of the semiconductor package 100 ofFIG. 1A along line 2-2 in FIG. 1B. The semiconductor package 100includes the die 102 having the first surface 103 opposite the secondsurface 104. The die 102 further includes sidewalls 116 extendingbetween the first and second surfaces 103, 104. In an embodiment, aheight of the sidewalls is between 100 microns and 400 microns. In otherembodiments, a height of the sidewalls is between 200 and 350 microns.The redistribution layer 110 is formed on the first surface 103 of thedie 102, and the plurality of under bump metallization layers 112 are onthe redistribution layer 110. Each of the plurality of solder balls 114is coupled to a corresponding one of the plurality of under bumpmetallization layers 112 formed on the redistribution layer 110, asdescribed above.

Further, the die 102 includes the first surface 103 bounded by the firstoutermost edge 118. In other words, the area of the first surface 103 isbounded by the first outermost edge 118 because the first outermost edge118 extends around the first surface 103 of the die 102. Theredistribution layer 110 is bounded by the second outermost edge 120extending around the redistribution layer 110. As such, the area of theredistribution layer 110 is bounded by the second outermost edge 120.

As shown in FIGS. 1A-B and FIG. 2 , the area of the redistribution layer110 is less than the area of the first surface 103 of the die 102, suchthat a portion 122 of the first surface 103 of the die 102 is exposed,or not covered, by the redistribution layer 110. When the moldingcompound 106 is formed on the die 102 and the redistribution layer 110to form the package 100, the molding compound 106 is on the sidewalls116 of the die 102 and the exposed portion 122 of the first surface 103of the die 102 between the first outermost edge 118 of the first surface103 of the die 102 and the second outermost edge 120 of theredistribution layer.

In other embodiments, the molding compound 106 includes a thirdoutermost edge 124 of a second sidewall 140 of the molding compound 106.A first distance 126 between the third outermost edge 124 of the moldingcompound 106 and the first outermost edge 118 of the first surface 103of the die 102 is less than a second distance 128 between the thirdoutermost edge 124 and the second outermost edge 120 of theredistribution layer 120. In other words, in the illustrated embodiment,the second distance 128 is greater than the first distance 126. Further,one skilled in the art will appreciate that in an embodiment, the firstdistance 126 corresponds to a first thickness of the molding compound106 between the third outermost edge 124 and one of the sidewalls of thedie 102. Similarly, the second distance 128 corresponds to a secondthickness of the molding compound 106 between the third outermost edge124 and the third sidewall 134 of the redistribution layer 110. In thisembodiment, the first thickness is less than the second thickness.

Further, the redistribution layer 110 includes a third surface 130adjacent the first surface 103 of the die and a fourth surface 132opposite the third surface 130 as well as a third sidewall 134 extendingbetween the third and fourth surfaces 130, 132. A plane of a fifthsurface 136 of the molding compound 106 is substantially coplanar with aplane of the fourth surface 132 of the redistribution layer 110. In yetfurther embodiments, the molding compound 106 includes a sixth surface138 wherein a plane of the sixth surface 138 is substantially coplanarwith the second surface 104 of the die 102.

FIG. 2 further illustrates that a plane of at least one of the sidewalls116 of the die 102 is spaced from a plane of the third sidewall 134 ofthe redistribution layer 110. In other words, the first outermost edge118 of the first surface 103 of the die 102 is spaced from the secondoutermost edge 120 of the third and fourth surfaces 130, 132 of theredistribution layer 110 to expose the portion 122 of the first surface103 of the die 102, such that when molding compound 106 is formed on thedie 102 and the redistribution layer 110, the molding compound 106 is onthe first surface 103 of the die 102 between the first and secondoutermost edges 118, 120.

A method of forming a semiconductor package having the featuresdescribed with reference to FIGS. 1A to 2 begins in FIG. 3 . FIG. 3 is across-sectional view of a wafer 200, which may be silicon or othersemiconductor material, having a first surface 202 opposite a secondsurface 204. The wafer includes a plurality of die that are formedsimultaneously in and on the wafer. For example, a first die 201 isadjacent to a second die 203 in the wafer. Each die includes a pluralityof active and passive circuit elements. Further, one of skill in the artwill appreciate that because the wafer 200 includes the plurality ofdie, such as the first die 201 and the second die 203, each of the die201, 203 include the first surface 202 opposite the second surface 204.

In FIG. 4 , a redistribution layer 206 a and 206 b is formed on thefirst surface 202 of the wafer 200. This first surface 202 is an“active” surface of the wafer 200 or otherwise includes a plurality ofcontact pads (not shown) that are coupled to circuitry (not shown)formed within each die 201, 203. The redistribution layer 206 a overlapsand is coupled to the first die 201 and the redistribution layer 206 boverlaps and is coupled to the second die.

Then, in FIG. 5 , a plurality of under bump metallization layers or ballsupports 208 are formed on each redistribution layer 206 a and 206 b.Alternatively, the method can proceed from FIG. 4 without forming theunder bump metallization layers 208. However, the remaining steps areprovided using an exemplary embodiment that includes the plurality ofunder bump metallization layers 208. In addition, embodiments of thepresent disclosure include using only a single redistribution layer 206a and 206 b, a single redistribution layer 206 a and 206 b incombination with one or more PI or PBO layers, as well as multipleredistribution layers and multiple redistribution layers in combinationwith one or more PI or PBO layers.

After the redistribution layer 206 a and 206 b is formed on the firstsurface 202 of the wafer 200 and the under bump metallization layers 208are formed on the redistribution layer 206 a and 206 b, a backgrindprocess is performed on the second surface 204 of the wafer 200, as inFIG. 6 . The backgrind may be performed by a mechanical grinding wheelor various types of etching, among other methods. The backgrind makesthe wafer 200 thinner, removing excess silicon or other semiconductormaterial that does not house or contain the electronic circuitry. Afterthe backgrind, the wafer 200 is singulated into a plurality of die 210,as in FIG. 7 . Singulation may be performed by mechanical blade, laserprocessing, or various types of etching, among other methods. As notedabove, the plurality of die 210 includes the first die 201 and thesecond die 203. However, one of skill in the art will also appreciatethat the plurality of die can include any number of die from 2 to morethan 1,000 die per wafer, depending on the size of the wafer 200,spacing of the die 201, 203 on the wafer 200, and saw street size whensingulating the die, among other characteristics.

Each of the plurality of die 210 include sidewalls 212 extending betweenthe first surface 202 and the second surface 204 of each die 210.Further, each of the die 210 includes a portion of the redistributionlayer 206 a and 206 b on the first surface 202. As described herein, theredistribution layer 206 a corresponds to the first die 201 of theplurality of die 210 and the redistribution layer 206 b corresponds tothe second die 203 of the plurality of die 210. Accordingly, each of thedie 201, 203 of the plurality of die 210 include a respective portion206 a or 206 b of the redistribution layer 206 a and 206 b.

After the wafer 200 is singulated into the plurality of die 210, each ofthe die 210 are inverted and mounted onto a carrier 216, as in FIG. 8 .The carrier includes a layer 218 for receiving the under bumpmetallization layers 208. In an embodiment, the layer 218 includes atape. Alternatively, the layer 218 can receive the redistribution layer206 a and 206 b if under bump metallization layers 208 are not used. Agap or space 207 between the uncovered portion of the first surface 202of the die and the layer 218 remains.

After placing each of the die 210 on the carrier 216, molding compound220 is formed on the second surface 204 of each die 210, surroundingeach die 210, and in the gaps or spaces 207. As such, the moldingcompound 220 is on the sidewalls 212 of each die 210 and a portion 222of the first surface 202 of each die 210 that is exposed by theredistribution layer 206 a and 206 b. In other words, because an area ofthe redistribution layer 206 a and 206 b is less than an area of thefirst surface 202 of each die 210, the space or gap 207 is formedbetween outer edges of the redistribution layer 206 and 206 b and outeredges of the first surface 202 of each die 210, as explained above. Whenmolding compound 220 is formed over each die 210, the molding compoundwill be on the first surface 202 in the space 207 between the outeredges of the redistribution layer 206 a and 206 b and the first surface202, or a portion 222 of the first surface 202 adjacent to theredistribution layer 206 a and 206 b of each die 210.

Once the molding compound 220 is in place, each of the die 210 areuncoupled from the carrier 216 and inverted for further processing, asin FIG. 10 . FIG. 10 also illustrates that at this stage in themanufacturing process, the molding compound 220 couples each of theplurality of die 210 together to form a single, integral, unitary piece219. As will be described below, this single, integral, unitary piece219 is separated to form packages through additional processingvariations, with each package containing at least one die 210.

FIGS. 11A and 11B show one alternative embodiment of further methodsteps for forming a first plurality of semiconductor packages 224. InFIG. 11A, a first plurality of solder balls 226 are coupled to each ofthe under bump metallization layers 208 on the redistribution layer 206a and 206 b on each die 210. Then, in FIG. 11B, each of the plurality ofdie 210 are separated from each other along lines A-A to form the firstplurality of packages 224. The separating includes removing a portion228 of the molding compound 220 between lines A-A in FIG. 11A bymechanical blade, laser processing, or etching, among other methods.Each package 224 then includes a die 210 with molding compound 220 onthe second surface 204 of the die 210, as well as on the sidewalls 212of each die 210, and the portion 222 of the first surface 202 betweenouter edges of the redistribution layer 206 a and 206 b and the firstsurface 202 of each die 210.

FIGS. 12A to 12C illustrate a further alternative embodiment ofadditional method steps for forming a second plurality of semiconductorpackages 230. The additional processing begins with the unitary piece219 of FIG. 10 . Then, in FIG. 12A, a backgrind process is performed onthe molding compound 220 to remove molding compound 220 adjacent thesecond surface 204 of each die 210. In some cases, the backgrindingincludes exposing the second surface 204 of each die 210. Then, in FIG.12B, a second plurality of solder balls 232 are coupled to each of theunder bump metallization layers 208 after the backgrinding. Finally, inFIG. 12C, each of the plurality of die 210 are separated, as describedabove, into the second plurality of semiconductor packages 230. Theplurality of die 210 are separated by removing a portion 231 of themolding compound 220 along the lines B-B in FIG. 12B. Each of the secondplurality of semiconductor packages 230 illustrated in FIG. 12C includesan exposed second surface 204 of the die 210, and molding compound 220on the sidewalls 212, as well on the portion 222 of the first surface202 of each die 210 between the sidewall 212 of each die 210 and theredistribution layer 206 a and 206 b on the first surface 202 of eachdie.

FIGS. 13A to 13C illustrate a further alternative embodiment ofadditional method steps for forming a third plurality of semiconductorpackages 234. The additional processing begins with the unitary piece219 from FIG. 10 . Then, in FIG. 13A, a second plurality of solder balls236 are coupled to each of a corresponding one of the plurality of underbump metallization layers 208. Then, after the coupling, a backgrindprocess is performed on the molding compound 220 to remove moldingcompound 220 adjacent second surface 204 of each die 210. In some cases,the backgrinding includes exposing the second surface 204 of each die210. Finally, in FIG. 13C, each of the plurality of die 210 areseparated, as described above, into the third plurality of semiconductorpackages 234. The plurality of die 210 are separated by removing aportion 233 of the molding compound 220 along the lines C-C in FIG. 13B.Each of the third plurality of semiconductor packages 234 includes anexposed second surface 204 of the die 210, and molding compound 220 onthe sidewalls 212, as well on the portion 222 of the first surface 202of each die 210 between the sidewall 212 of each die 210 and theredistribution layer 206 a and 206 b on the first surface 202 of eachdie.

Further, as described above, the method may proceed without forming theplurality of under bump metallization layers 208. In such a case, theprocessing continues without the under bump metallization layers and afourth plurality of packages can be created by coupling a fourthplurality of solder balls to the redistribution layer and separatingeach of the plurality of die, as described above. In an embodiment,forming the fourth plurality of packages includes backgrinding themolding compound before coupling the fourth plurality of solder balls tothe redistribution layer.

As can be appreciated from the foregoing description, embodiments of thepresent disclosure allow for formation of semiconductor packages withmolding compound on the sidewalls of a die, wherein the thickness of themolding compound can be controlled during processing in order to protectthe die during transport of the finished package. For example, existingapproaches for forming a WLCSP, such as a front side mold approach or afan out approach, include forming molding compound on the sidewalls, ifat all, to a maximum thickness of between 5 to 20 microns. By varyingthe die to die spacing when mounting the die 210 on the carrier 216, asin FIG. 8 , a thickness of the molding compound 220 adjacent eachsidewall 212 of each die 210 can be controlled. In an embodiment, thethickness of the molding compound 220 between an outer edge of themolding compound 220 and the sidewall 212 of the die is approximately 40to 70 microns. In other embodiments, the thickness is between 30 to 80microns, and in yet further embodiments, the thickness is between 20 to90 microns.

As such, the significantly thicker molding compound 220 present on thesidewalls 212 of each die 210 in the semiconductor packages describedherein provide adequate protection against chipping or cracking of thedie 210 during transport. In addition, because the thickness of themolding compound 220 can be controlled, embodiments of the presentdisclosure can be adapted to provide an adequate amount of protectionfor a number of different applications. The molding compound on theportion 222 of the first surface 202 of each die 210 provides similarprotection to the die 210, thus preventing chipping at the corners ofthe die 210, or on the first surface 202 of the die 210 between an outeredge of the redistribution layer 206 a and 206 b and an outer edge ofthe first surface 202 of each die 210.

The processes for forming such a package described herein are also moreefficient than previous processes because there is no potential for moldresidue to be left on the plurality of solder balls, thus eliminating anadditional step in the process of forming prior packages. Further,certain embodiments of the present disclosure include using only asingular redistribution layer between a surface of the die and the underbump metallization layers, or solder balls, and as such, embodiments ofthe present disclosure further eliminate additional processing steps offorming PI or PBO layers on the die, while also reducing the amount ofmaterial required to produce a package.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The invention claimed is:
 1. A method, comprising: forming a pluralityof packages by: forming a redistribution layer including at least oneinsulating layer and at least one conductive layer on the at least oneinsulating layer, the redistribution layer being formed on a firstsurface of a wafer; backgrinding a second surface of the wafer oppositeto the first surface of the wafer; separating a plurality of die eachincluding sidewalls extending from the first surface to the secondsurface and each including a portion of the redistribution layer bysingulating the wafer and the redistribution layer; coupling ones of theportions of the redistribution layers to a carrier by inserting theportions of the redistribution layers in an adhesive layer on thecarrier, inserting the portions of the redistribution layers into theadhesive layer includes inserting sidewalls of the portions of theredistribution layers into the adhesive layer at least partiallycovering sidewalls of the portions of the redistribution layers;covering the sidewalls and the second surfaces of the plurality of dieby forming a molding compound on the plurality of die and the carrier;and singulating the plurality of packages between ones of the pluralityof die and through the molding compound.
 2. The method of claim 1,wherein inserting the portions of the redistribution layers into theadhesive further includes entirely covering sidewalls of ones of theportions of the redistribution layer by fully inserting the sidewalls ofthe portions of the redistribution layer into the adhesive.
 3. Themethod of claim 2, wherein forming the molding compound further includesforming a third surface of the molding compound substantially flush withones of the first surfaces of the plurality of die.
 4. The method ofclaim 3, wherein forming the molding compound further includes leavingperipheral portions of the first surfaces of ones of the plurality ofdie each around a corresponding one of the portions of theredistribution layers exposed from the molding compound.
 5. The methodof claim 1, wherein inserting the sidewalls of the portions of theredistribution layers into the adhesive layer further includes forminggaps between the first surfaces of ones of the plurality of die and theadhesive layer by partially inserting the sidewalls of the portions ofthe redistribution layers into the adhesive layer partially coveringsidewalls of the portions of the redistribution layers and spacing apartthe first surfaces of the plurality of die from the adhesive layer. 6.The method of claim 5, wherein forming the molding compound furthercomprising partially covering the sidewalls of the portions of theredistribution layers partially inserted into the adhesive layer.
 7. Themethod of claim 6, wherein forming the molding compound further includescovering peripheral portions of the first surfaces of ones of theplurality of die around a corresponding ones of the redistributionlayers.
 8. A method, comprising: inserting an under bump metallizationlayer extending from a redistribution layer on a first surface of a dieinto an adhesive layer on a carrier; inserting portions of theredistribution layer into the adhesive layer forming gaps between thefirst surface of the die and the adhesive layer by partially insertingsidewalls of the redistribution layer extending from the first surfaceof the die into the adhesive layer; covering a second surface of the dieopposite to the first surface and sidewalls of the die with a moldingcompound; and removing the die and the redistribution layer from thecarrier by removing the redistribution layer from the adhesive layer. 9.The method of claim 8, further comprising exposing the second surface ofthe die by removing a portion of the molding compound covering thesecond surface.
 10. The method of claim 9, wherein removing the portionof the molding compound further includes grinding the portion of themolding compound.
 11. The method of claim 8, further comprising forminga plurality of solder balls on the redistribution layer.
 12. The methodof claim 8, wherein forming the molding compound further includesfilling the gaps with the molding compound, covering the sidewalls ofthe redistribution layer protruding from the first surface of the diewith the molding compound, and covering a peripheral portion of thefirst surface adjacent to the sidewalls of the redistribution layer withthe molding compound.
 13. The method of claim 8, wherein inserting theredistribution layer into the adhesive layer further includes fullyinserting sidewalls of the redistribution layer extending from the firstsurface of the die.
 14. A method, comprising: forming a package by:inserting an under bump metallization extending from a redistributionlayer on a first surface of a die into an adhesive layer on a carrier,inserting the under bump metallization into the adhesive layer includesforming a gap between the first surface of the die and the adhesivelayer and between the sidewalls of the die and sidewalls of theredistribution layer; and after placing the under bump metallizationinto the adhesive layer, forming a molding compound on a second surfaceof the die opposite to the first surface, sidewalls of the die, andbetween the die and the adhesive layer.
 15. The method of claim 14,further comprising coupling a second surface of the redistribution layerto the adhesive layer.
 16. The method of claim 14, wherein forming themolding compound further includes filling the gap with the moldingcompound covering the sidewalls of the redistribution layer and coveringa peripheral portion of the first surface of the die with the moldingcompound.
 17. The method of claim 14, further comprising fully coveringsidewalls of the redistribution layer with the adhesive layer on thecarrier by placing the sidewalls of the redistribution layer into theadhesive layer.
 18. The method of claim 17, wherein forming the moldingcompound further includes forming a third surface of the moldingcompound coplanar with the first surface of the die.
 19. The method ofclaim 14, further comprising: partially inserting sidewalls of theredistribution layer into the adhesive layer; wherein forming themolding compound including filling the gap with the molding compoundpartially covering the sidewalls of the redistribution layer andcovering a peripheral portion of the first surface adjacent to thesidewalls of the redistribution layer.